TOKYO–(BUSINESS WIRE)–Sep 29, 2024–
Mitsubishi Electric Corporation (TOKYO: 6503) announced today that its Power Device Works’ Fukuyama Factory has begun large-scale supply of power semiconductor chips made from 12-inch silicon (Si) wafers for the assembly of semiconductor modules, effective immediately. The advanced Si power-semiconductor modules will initially be used in consumer products. Going forward, Mitsubishi Electric expects to contribute to green transformation (GX) by providing a stable and timely supply of semiconductor chips to meet the growing demand for energy-saving power-electronics devices in various applications.
The Fukuyama Factory processes wafers for the production of Si power-semiconductors. The factory is playing a key role in Mitsubishi Electric’s medium-term plan to double its wafer processing capacity for Si power- semiconductors by fiscal 2026 compared to five years earlier. By supplying large quantities of 12-inch Si wafers for power semiconductor chips, the company will ensure stable production of advanced Si power-semiconductor modules for energy-saving power-electronics equipment.
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CONTACT: Customer Inquiries
Semiconductor & Device Marketing Dept.A and Dept.B
Mitsubishi Electric Corporation
www.MitsubishiElectric.com/semiconductors/Media Inquiries
Takeyoshi Komatsu
Public Relations Division
Mitsubishi Electric Corporation
Tel: +81-3-3218-2346
[email protected]
www.MitsubishiElectric.com/news/
KEYWORD: JAPAN ASIA PACIFIC
INDUSTRY KEYWORD: SEMICONDUCTOR CONSUMER ELECTRONICS TECHNOLOGY MANUFACTURING OTHER MANUFACTURING HARDWARE
SOURCE: Mitsubishi Electric Corporation
Copyright Business Wire 2024.
PUB: 09/29/2024 10:10 PM/DISC: 09/29/2024 10:10 PM
http://www.businesswire.com/news/home/20240929169092/en
